Metal based (core) PCB
Metal material ：Aluminium, copper
Copper foil thickness：≤6 OZ
Copper layers：Single-sided, double sided, multilayer metal core
Thermal conductivity：2-12w/m∙k
Thermo-electric separation PCB
Material：Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment ：Flat, Sinking
Outer layer copper(base)：0.5-18oz
Copper base thickness：0.8-3.2mm
High frequency board
Material：Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure ：Single material,hybrid pressing,metal based.
Surface finish ：Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count：16
Millimeter wave radar board
Material：PTFE+FR-4
Linear precision：±8μm
Special technology：Blind & buried vias, POFV.
Technology advantage：PTFE multi-layer, Hybrid pressing.
EA value：≤15um
Stepped G/F board
Board thickness ：rn≥2.0mm
G/F thickness：≤1.6mm±0.1mm
G/F tolerance：±0.05mm
Layer count ：≤44 layers
Optical transceiver
Material：FR4, high frequency, high speed material
Finger size tolerance：±0.075mm
Special technology ：HDI micorvia filling
Signal transmission rate ：≤100 Gbps
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mujingguan.com
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