Blind & Buried vias PCB
Layer count:12 layer
Aspect ratio:12
Min hole size:0.15mm
Line width/space:4/4mil
Blind vias:1-2/1-3/1-4/1-5
High density build up
Various surface finishes
Microvia filling and stacked vias
Thin board and surface flatness
Communications
Related products
Metal based (core) PCB
Metal material:Aluminium, copper
Copper foil thickness:≤6 OZ
Copper layers:Single-sided, double sided, multilayer metal core
Thermal conductivity:2-12w/m∙k
Thermo-electric separation PCB
Material:Thermal conductivity (0.3-2W/m∙k)
Thermal pad treatment:Flat, Sinking
Outer layer copper(base):0.5-18oz
Copper base thickness:0.8-3.2mm
High frequency board
Material:Rogers,Taconic,Arlon,Panasonic,TUC,Wangling
Structure:Single material,hybrid pressing,metal based.
Surface finish:Copper,OSP,ENIG,Immersion Tin, HASL
Max layer count:16
Millimeter wave radar board
Material:PTFE+FR-4
Linear precision:±8μm
Special technology:Blind & buried vias, POFV.
Technology advantage:PTFE multi-layer, Hybrid pressing.
EA value:≤15um
Address: No.389 Shetang road, Economic and Technological Development Zone, Changsha, China.
TEL: 0731-82786288-6818
Email: sales02@mujingguan.com
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